Thermal Paste

Showing all 10 results

PHASAK DTA 005 Thermal Paste (White · 0.5 g) – ≥0.925 W/m·K

0.5 g white thermal compound with ≥0.925 W/m·K and ≤0.229 °C/W. Optimizes contact between heatsink and chip to lower temperatures in CPUs, GPUs, and chipsets.
PHASAK DTA 015 thermal paste (White · 1.5 g) – ≥0.925 W/m·K

1.5 g white thermal paste with ≥0.925 W/m·K and ≤0.229 °C/W. “Max” format for multiple applications or equipment.
PHASAK DTA 016 thermal paste (Grey · 0.5 g) – ≥1.695 W/m·K

0.5 g grey thermal compound with ≥1.695 W/m·K and ≤0.126 °C/W. Superior performance for high-use equipment and reduced form factor.
PHASAK DTA 017 Thermal Paste (Gold, 0.5 g) – ≥1.8 W/m·K

0.5 g gold thermal compound with ≥1.8 W/m·K and ≤0.123 °C/W. Excellent thermal transfer for enthusiast systems.
PHASAK DTA 018 thermal paste (Silver · 0.5 g) – ≥1.93 W/m·K

0.5 g silver thermal compound with ≥1.93 W/m·K and ≤0.115 °C/W. Maximum efficiency in the Mini series for high-performance equipment.
PHASAK DTA 025 Thermal Paste (White · 25 g) – ≥0.925 W/m·K

25 g thermal compound with ≥0.925 W/m·K and ≤0.229 °C/W. Professional format for workshops and support services.
PHASAK DTA 035 Thermal Paste (White · 5 g) – ≥0.925 W/m·K

5 g white thermal compound with ≥0.925 W/m·K and ≤0.229 °C/W. Stable performance and quantity for multiple interventions.
PHASAK DTA 038 Thermal Paste (White · 8 g) – ≥0.925 W/m·K

8 g thermal paste with ≥0.925 W/m·K and ≤0.229 °C/W. Ideal for preventive maintenance on multiple units.
PHASAK DTA 050 Thermal Paste (White · 50 g) – ≥0.925 W/m·K

50 g jar of white thermal paste with ≥0.925 W/m·K and ≤0.229 °C/W. High quantity-to-price ratio for laboratories and intensive maintenance.
PHASAK DTA 052 thermal paste (Grey · 50 g) – ≥1.695 W/m·K

50 g jar of grey thermal paste with ≥1.695 W/m·K and ≤0.126 °C/W. High-performance option for demanding thermal loads.