PHASAK DTA 005 Thermal Paste (White · 0.5 g) – ≥0.925 W/m·K
0.5 g white thermal compound with ≥0.925 W/m·K and ≤0.229 °C/W. Optimizes contact between heatsink and chip to lower temperatures in CPUs, GPUs, and chipsets.
Description
PHASAK DTA 005 is a white thermal paste of 0.5 g designed to improve heat transfer between the processor and the heatsink. Its conductivity of ≥0.925 W/m·K and low thermal impedance of ≤0.229 °C/W allow for more efficient and stable dissipation.
- Applications: CPU, GPU, chipsets, and power modules.
- Format: 0.5 g syringe for specific applications and replacements.
- Facilitates contact and reduces hot spots.
Additional information
| Weight | 0.004 kg |
|---|---|
| Dimensions (H × W × D) | 12 × 32 × 82 mm |
| Packaging | 82 × 32 × 12 mm |
| Peso Bruto | 0,004 kg |
