Thermal paste in syringe

Enhance the cooling of your equipment with PHASAK thermal paste. Our range is formulated to offer high conductivity and low impedance, ensuring uniform contact between the chip and the heatsink to improve heat transfer and help maintain more stable temperatures. Ideal for CPUs, GPUs, consoles, laptops, mini-PCs, and workstations, both in gaming and professional and maintenance environments.

Choose the format that best fits your use: Mini (0.5 g) for specific interventions, Max (1.5–25 g) for multiple assemblies, and XL (50 g) for workshops and technical services. All references are easy to apply, non-corrosive, and compatible with standard heatsinks and surfaces.